ENGINEERING EXCELLENCE

Precision Assembly for Every Complexity Level

PCBLion operates fully integrated SMT, THT, and DIP assembly lines capable of handling everything from simple single-sided boards to high-density BGA and FPGA assemblies. Every order goes through one-to-one engineering review, full BOM and component inspection, and first-piece testing before production is released, ensuring consistent quality from the first unit to the last.

Below are just some of our capability specifications:

SpecificationValue
Placement Accuracy±0.035mm (Cpk ≥ 1)
Placement Speed42,000 CPH
Max Feeder Inputs112
Min Board Size50 x 50mm
Max Board Size1,200 x 370mm
Max Rectangular Component Size50 x 150mm
Max Square Component Size74 x 74mm
Max Component Height25mm
PCB Thickness Range0.3mm to 4.0mm
Min Component Size0201
Assembly TypesSMT / THT / DIP
BGA / FPGA SupportYes
First-piece TestingYes
BOM & Component InspectionYes
Engineering SupportOne-to-one

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