Multilayer PCB Manufacturer
As a leading custom multilayer PCB manufacturer, PCBLION delivers precision 4-40 layer printed circuit boards for automotive, medical, and industrial applications. Trusted by 500+ global companies for high-reliability stack-ups.
Engineering Excellence
Equipped with LDI technology and specialized materials, we provide 24-hour DFM support through our 50+ engineering experts.
High Circuit Density
Vertical integration of signal, power, and ground planes for complex routing requirements.
Signal Integrity
Controlled impedance routing and reduced EMI for high-speed digital and RF applications.
Thermal Support
Dedicated copper planes for superior heat dissipation up to 18oz copper weight.
| Feature / Category | Technical Specification |
|---|---|
| Layer Count | 4-40 layers (Mass Production Capability) |
| Board Dimensions | Max: 600mm × 770mm | Thickness: 0.4mm – 8.0mm |
| Trace Width/Spacing | Minimum 3mil/3mil using LDI technology |
| Drilling Capabilities | 0.15mm Mechanical | 0.1mm Laser | 16:1 Aspect Ratio |
| Base Materials | Isola 370HR, Rogers 4350B/4003C, Shengyi S1000-2, Polyimide |
| Impedance Control | Standard ±10% | Tight ±5% | Ultra-tight ±3% (Polar CITS500s) |
| Surface Finish | ENIG, Immersion Silver, OSP, Hard Gold, ENEPIG (RoHS compliant) |
| Quality Standards | IPC-A-600 Class 3 | IATF 16949 | ISO 13485 | UL Certified |
Advanced Multilayer PCB Manufacturing Process
Precision-engineered steps ensuring reliability from the inner layer to final inspection.
Inner Layer Imaging & Etching
- LDI (Laser Direct Imaging) technology for trace/space down to 3/3 mil
- Automated optical inspection (AOI) at every inner layer
Layer Alignment & Lamination
- Precision pin lamination system with ±2mil hole position tolerance
- Vacuum lamination press for void-free bonding
- Support for hybrid stack-ups: Rogers 4350B + FR4 for RF/mixed-signal designs
Drilling & Plating
- Mechanical drilling: 0.15mm minimum finished hole diameter
- Laser drilling: 0.1mm microvias for HDI integration
- Aspect ratio capability: Up to 16:1 for thick multilayer boards
- Copper plating uniformity: ±10% across panel
Impedance Control & Testing
- Polar CITS500s impedance tester for 100% lot verification
- Standard tolerance: ±10%
- Advanced/RF tolerance: ±5% or ±3% for high-speed digital and 5G applications
- Automated TDR (Time Domain Reflectometry) analysis available
Surface Finish & Final Inspection
- ENIG, Immersion Silver, OSP, Hard Gold, ENEPIG options
- Automated flying probe testing for electrical continuity
- Microsection analysis for layer registration and plating thickness verification
Design Stack-Up Options
Standard and custom configurations tailored to your specific application requirements.
4-Layer Standard Stack-Up (Signal-Ground-Power-Signal):
- Ideal for: General-purpose digital circuits, IoT devices
- Impedance: 50Ω single-ended, 100Ω differential
- Material: Shengyi S1000-2 (Tg 150°C)
6-Layer High-Speed Stack-Up:
- Ideal for: Automotive ADAS, industrial controllers
- Tight impedance control: ±5%
- Material: Isola 370HR (Tg 180°C)
8-12 Layer Complex Stack-Up:
- Ideal for: Medical imaging, RF transceivers
- Hybrid materials: Rogers 4350B (Dk 3.48) + FR4
- Proven track record: 14-layer HDI with 0.35mm pitch BGA
20-40 Layer High-Density Stack-Up:
- Ideal for: High-performance computing, telecom infrastructure
- Advanced materials: Multiple ground/power planes for signal integrity
- 16:1 aspect ratio capability for reliable via plating
Industry Applications
Delivering high-reliability multilayer solutions across critical sectors.
- Engine Control Units (ECU): 8-10 layer boards with -40°C to +125°C operating range
- ADAS Systems: 12-layer designs with controlled impedance for camera and radar modules
- Battery Management Systems (BMS): Heavy copper power planes (up to 18oz) combined with signal layers
- Patient Monitoring: 6-8 layer boards with low-noise ground planes
- Diagnostic Equipment: 10-14 layer designs for high-speed data acquisition
- Implantable Devices: Rigid-flex multilayer integration for miniaturization
- PLC Controllers: 6-8 layer boards with robust EMI shielding
- Motor Drives: 8-10 layer power boards with 3-6oz copper
- Instrumentation: 10-12 layer precision analog designs with separate analog/digital ground planes
- 5G Base Stations: 12-16 layer RF boards with Rogers 4350B + FR4 hybrid stack-ups
- Gateway Devices: 6-8 layer designs balancing cost and performance
- Smart Sensors: 4-6 layer compact designs with integrated antennas
- Avionics: 20-40 layer high-reliability boards with ceramic substrates
- Satellite Communication: 12-20 layer boards with polyimide materials
- Navigation Systems: 10-16 layer precision designs with tight impedance control
Frequently Asked Questions
As an experienced Multilayer PCB Manufacturer, we are ready to answer your questions.
What is the maximum layer count you can manufacture?
We manufacture up to 40 layers in mass production. Our proven track record includes 14-layer HDI boards with 0.35mm pitch BGA for automotive and medical applications.
How do you ensure layer-to-layer registration accuracy?
We use precision pin lamination with ±2mil hole position tolerance, verified by microsection analysis per IPC-A-600 Class 3.
Can you handle hybrid material stack-ups?
Yes. We regularly build hybrid stack-ups combining Rogers 4350B (for RF sections) with FR4 (for digital sections) in the same board. Our engineering team will optimize the transition zones during DFM review.
Ready to Start Your Project with a Trusted Multilayer PCB Manufacturer?
Whether it’s a 4-layer prototype or a 40-layer production run, our engineering team is ready to provide free DFM feedback within hours.