PCB Fabrication Capabilities
PCBLion’s fabrication facility supports the full range of PCB types and technologies, from standard multilayer boards to advanced HDI, rigid-flex, flexible, and metal core designs. Every board is manufactured to the same process standards regardless of order quantity, giving engineers and procurement teams a reliable, consistent production partner from prototype through mass production.
Below are just some of our capability specifications:
HDI PCB
| Specification | Value |
|---|---|
| Maximum Layers | 24 |
| HDI Stack-up | 3+N+3 |
| Max Processing Board Size | 620 x 720mm |
| Min Line Width / Space (Inner Layer) | 2.5mil / 2.5mil |
| Min Line Width / Space (Outer Layer) | 4mil / 4mil |
| Max Board Thickness | 3.5mm |
| Min Drill Bit | 6mil |
| Aspect Ratio | 18:1 |
| Min Micro Via Diameter | 4mil |
| Min Micro Via Aspect Ratio | 0.8:1 |
| Min Core Board Thickness | 2mil |
| Layer Alignment | 5mil |
| Solder Mask Tolerance | ±8% |
| Back Drill Stub | 2 to 10mil |
| Copper Fill | Supported |
| POFV | Supported |
| Buried Copper Block | Supported |
Plated Through-Hole PCB
Covers high-frequency, ceramic, thick copper, high-Tg, and halogen-free board types.
| Specification | Value |
|---|---|
| Maximum Layers | 24 |
| Max Processing Board Size | 620 x 950mm |
| Min Line Width / Space (Inner Layer) | 2.5mil / 2.5mil |
| Min Line Width / Space (Outer Layer) | 4mil / 4mil |
| Max Board Thickness | 4.0mm |
| Min Drill Bit | 6mil |
| Aspect Ratio | 18:1 |
| Min Core Board Thickness | 2mil |
| Layer Alignment | 5mil |
| Solder Mask Tolerance | ±8% |
| Back Drill Stub | 2 to 10mil |
| POFV | Supported |
| Buried Copper Block | Supported |
Flexible PCB
| Specification | Value |
|---|---|
| Layer Count | 1 to 8 layers |
| PCB Thickness (1 to 4 layer) | 0.1mm to 0.5mm |
| PCB Thickness (5 to 8 layer) | 0.6mm to 0.8mm |
| Thickness Tolerance (≤0.3mm) | ±0.03mm |
| Thickness Tolerance (0.3mm to 0.8mm) | ±10% |
| Max Finished Size | 7.8 x 21.8 inch |
| Min Finished Size | 2 x 4mm |
| Min Line Width / Space | 0.035mm / 0.035mm |
| Min Interlayer Alignment | ±0.05mm |
| Surface Finishes | ENIG, OSP, ENEPIG, Immersion Tin |
Rigid-Flex PCB
| Specification | Value |
|---|---|
| Maximum Layers | 24 |
| Flex Layer Count | Up to 18 layers |
| Min Laser Blind Hole Aperture | 0.1mm |
| Finished PCB Thickness | 0.2mm to 4.0mm |
| Thickness Tolerance (above 1.0mm) | ±10% |
| Thickness Tolerance (1.0mm and below) | ±0.1mm |
| Min Flex Layer Width | 2.5mm |
| Max Panel Size | 406 x 736mm |
| Min Panel Size | 10 x 15mm |
| Impedance Tolerance (Single-ended) | ±3Ω at ≤50Ω / ±8% above 50Ω |
| Impedance Tolerance (Differential pair) | ±4Ω at ≤50Ω / ±8% above 50Ω |
| HDI Type | 3+N+3 |
| Min BGA Pad Size | 10mil |
Aluminum & Copper Core PCB
| Specification | Value |
|---|---|
| Aluminum PCB Layer Count | 1 to 4 layers |
| Copper Core PCB Layer Count | 1 to 8 layers |
| Max PCB Size | 500 x 1200mm |
| Finished Copper Thickness | 0.5oz to 4oz |
| Metal Base Thickness | 0.8mm to 2.6mm |
| Thermal Prepreg Thickness | 0.05mm to 0.2mm |
| Thermal Conductivity | 0.5 W/m·K to 6 W/m·K |
Fabrication Services
Get In Touch With Us
If you have any further questions or queries please do not hesitate to get in touch.
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